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Dimensing Technology’s displacement sensors have been designed to have exceptional measurement performance, affordable cost and easy integration. The displacement measurement range can reach up to 4 mm, allowing various applications for semiconductor and industrial use. The device is Ethernet/USB pluggable and does not require any external controller unit, enabling easily integration into different application environments.
SWIR band light can penetrate through many semiconductor materials, such as Si, InP, GaAs, etc. Displacement sensors with SWIR light source have specific advanteages of measuring thickness of these wafer substrates and features under the substrates.
Specifications
Specifications
Notes:
The maximum tilt angle applies to mirror-reflective samples. For diffuse reflective surfaces, the tilt angle requirement can be relaxed appropriately.
The value is the standard deviation calculated from 500 sampling points on static mirror-reflective sample measured at 20,000 Hz. Test condition is on a non-air-floating optical breadboard.
The above specifications can be adjusted according to application requirements.
Applications
Applications
Thickness Measurements
Displacement Measurements
Application cases - Silicon wafer thickness measurement
Application cases - Silicon wafer thickness measurement
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